Ruthenium Coated Titanium Anode for Copper Recovery

Ruthenium Coated Titanium Anode for Copper Recovery

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Product Description

Product Attributes

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Product Description

Product Attributes

Brand: PSX

Place Of Origin: China

Areas Of Application:: PCB industry production process produces a large number of micro-etching solution, etching solution, copper nitrate, etc. containing different concentrations of copper.

Current Density:: （200-400）A/m2

Lifespan:: 12-24 months

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Set/Sets

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Product Description

What is Ruthenium Coated Titanium Anode for Copper Recovery？

Ruthenium Coated Titanium Anode is an anode material used in electrolyzers and other electrochemical equipment. The material consists of a titanium (Ti) substrate and a ruthenium (Ru) oxide coating. This coating significantly improves the corrosion resistance and electrocatalytic activity of the titanium substrate, making it more suitable for prolonged electrolytic operation in strongly acidic or alkaline environments.

Specifically, titanium itself has good mechanical properties and corrosion resistance, but its electrocatalytic activity is low. By coating its surface with a layer of ruthenium oxide, its electrocatalytic activity can be greatly enhanced, making it an ideal electrolytic anode material. These anodes are widely used in water electrolysis for hydrogen production, in the chlor-alkali industry and in a variety of other areas where efficient electrolytic processes are required.

Ruthenium Coated Titanium Anode for Copper Recovery is used in the PCB industry production process produces a large number of micro-etching solution, etching solution, copper nitrate, etc. The Ruthenium Coated Titanium Anode for Copper Recovery is an electrolytic anode that can be used in a variety of electrolytic processes that require high efficiency. solution, etching solution, copper nitrate, etc. containing different concentrations of copper.

Ruthenium Coated Titanium Anode for Copper Recovery background and introduction:

PCB industry production process produces a large number of micro-etching solution, etching solution, copper nitrate, etc. containing different concentrations of copper and other metals, high recycling value, and the discharge of wastewater will have a small amount of copper and heavy metals, such as can not be reasonably environmentally friendly treatment, on the one hand, resulting in a serious waste of resources, on the other hand, after the discharge of heavy metals seepage to the soil and water sources, that is, the natural environment on which we depend for our survival and their own health. Produce serious pollution and harm.

1) Micro-etching solution

Micro-etching solution includes sodium persulfate/sulfuric acid system and hydrogen peroxide/sulfuric acid system, which is widely used in PCB surface treatment process in recent years, such as: copper sinking (PTH) process, electroplating process, internal pre-treatment, green oil pre-treatment, OSP treatment and other production lines, direct electrolysis is destructive to the anode coating.

2) Etching solution

In the electronic circuit board (PCB) etching process, the etching solution in the copper content gradually increased. Etching solution to achieve better etching results, each liter of etching solution needs to contain 120 to 180 grams of copper and the corresponding amount of etching salt (NH4CI) and ammonia (NH3). Etching solution regeneration recycling system has acidic, alkaline, the two systems can be divided into extraction method, direct electrolysis method.

Can be a large number of originally need to discharge after the use of etching liquid restoration regeneration into a regeneration of etching liquid can be used again. Thus reducing the emissions of production waste liquid, reuse to reduce production costs, and can be extracted from high-purity electrolytic copper metal.

ruthenium-iridium coated titanium anodes

Process Flow:

A. Micro etching solution (Cu2SO4+H2O2) Oxygen breaking electrolyzer (decomposition of H2O2) Electrolysis copper

B. Alkaline etchant Extractive process Copper sulfate + sulfuric acid Copper electrowinning

C. Acid etching solution Ionization membrane electrolysis (electrolysis of copper) Tail gas treatment (absorption of chlorine gas)

Electrochemical performance and life test (reference standard HG/T2471-2007 Q/CLTN-2012)

Title	Enhanced weightlessness mg	Polarization rate mv	Oxygen/chlorine potential V	Test conditions
Titanium-based iridium-tantalum	≤1	＜40	＜1.45	1mol/L H2SO4
Titanium-based ruthenium-iridium	≤10	＜40	＜1.13	1mol/L H2SO4