Titanium Material has a metallic luster and is ductile. Sound travels through it at a rate of 5090 m/s. The main characteristics of titanium are its low density, high mechanical strength, and ease of machining. The new Titanium Alloy has good heat resistance and can be used for a long time at 600℃ or higher. High-purity titanium as an important functional thin film materials in the field of electronic information, in recent years, with the rapid development of China's integrated circuits, flat panel displays, solar energy and other industries, the demand is rising rapidly. Magnetron sputtering technology is one of the key technologies for the preparation of thin film materials, and high-purity titanium sputtering target is a key consumable in the magnetron sputtering process, which has a broad market application prospect. The development of high-performance titanium sputtering target is an important measure to realize the independent development of key materials for the electronic information manufacturing industry and to promote the transformation and upgrading of the titanium industry to the high-end. Titanium target applications and performance requirements magnetron sputtering - Ti targets are mainly used in the electronics and information industry, such as integrated circuits, flat panel displays and home furnishings and automotive industry decorative coating areas, such as glass decorative coating and wheel decorative coating.
Different industries Ti target requirements are also very different, mainly including: purity, microstructure, welding performance, dimensional accuracy of several aspects, the specific indicators are as follows.
1) Purity: 99.9% for non-integrated circuits; 99.995% and 99.99% for integrated circuits. 2) microstructure: non-integrated circuits: the average grain size of less than 100μm; integrated circuits: the average grain size of less than 30μm, the average grain size of ultra-fine crystals less than 10μm
3) Welding performance: non-integrated circuits: brazing, monolithic; integrated circuits: monolithic, brazing, diffusion welding
4) Dimensional accuracy: for non-integrated circuits: 0.1mm; for non-integrated circuits: 0.01mm
1. magnetron sputtering Ti target preparation technology
Ti target raw material preparation technology according to the production process can be divided into electron beam melting blanks and vacuum self-consumption arc furnace melting blanks (two categories), in the target preparation process, in addition to strict control of the material purity, densities, grain size, and crystalline orientation, the heat treatment process conditions, the subsequent molding and processing also need to be strictly controlled in order to ensure that the quality of the target. For high-purity Ti raw materials are usually first used in the melt electrolysis method to remove the high melting point of impurity elements in the Ti matrix, and then vacuum electron beam melting is used to further purify. Vacuum electron beam melting is the use of high-energy electron beam stream bombardment of the metal surface, followed by a gradual increase in temperature until the metal melts, the vapor pressure of the elements will be preferentially volatilized, the vapor pressure of the elements of the small elements remain in the melt, the greater the difference between the vapor pressure of the impurity elements and the substrate, the better the effect of purification. The advantage of vacuum refining after melting is that the impurity elements in the Ti matrix are removed without introducing other impurities. Therefore, when electron beam melting 99.99% electrolytic Ti in a high vacuum environment, the impurity elements (iron, cobalt, copper) in the raw material whose saturation vapor pressure is higher than the saturation vapor pressure of the Ti element itself will be volatilized preferentially, so that the impurity content in the matrix will be reduced, thus achieving the purpose of purification. The combination of the two methods can be obtained more than 99.995 purity of high-purity titanium metal.
2.Ti target material Titanium Target Block technical requirements
To ensure the quality of the deposited film, the quality of the target material must be strictly controlled by a large number of practice, the main factors affecting the quality of the Ti target material, including purity, average grain size, crystallographic orientation and structural uniformity, geometry and size.
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