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Titanium Target Block

There are 4 products

  • Titanium Sputtering Target Block

    Brand:PSX

    Min. Order:1 Others

    Place of Origin:China

    What is Titanium Sputtering Target Block? Titanium Material has a metallic luster and is ductile. Sound travels through it at a rate of 5090 m/s. The main characteristics of titanium are its low density, high mechanical strength, and ease of...

  • ASTM B348-97 Titanium Round Target Block

    Brand:PSX

    Min. Order:1 Others

    Place of Origin:China

    What is the block of titanium? Titanium Round Target Block is a type of Titanium target block and a titanium forging that we often process in Titanium Material. Titanium targets play an important role in science and industry because of their...

  • High Quality Titanium Forgings

    Brand:PSX

    Min. Order:1 Others

    Place of Origin:China

    The Titanium target block is a specialized Titanium Material mainly used in Physical Vapor Deposition (PVD) and Magnetron Sputtering techniques, where PVD is widely used in the production of advanced coatings, while Magnetron Sputtering is commonly...

  • High Quality Titanium Alloy Forgings

    Brand:PSX

    Min. Order:1 Others

    Place of Origin:China

    Is titanium good for forging? Titanium alloy is a new type of metal structure material developed after the 1840s. Its main features are low density, high strength, especially high specific strength (strength/density), and good heat resistance and...

Titanium Target Block Trivia
1.
Impurity content
Impurities in the solids of the Titanium Target Block and oxygen and moisture in the pores are the main sources of contamination in the deposited films. Targets for different applications have different requirements for different impurity contents. For example, pure aluminum and aluminum alloy targets for the semiconductor industry have special requirements for alkali metal content and radioactive element content.
2.
Density
In order to reduce the pores in the target solids and improve the performance of sputtered films, the target is usually required to have a high density. The density of the target not only affects the sputtering rate, but also influences the electrical and optical properties of the film. The higher the target density, the better the performance of the film. In addition, increasing the density and strength of the target allows the target to better withstand the thermal stresses of the sputtering process. Density is also one of the key performance indicators of target material, grain size and grain size distribution.
Usually the target is polycrystalline structure, the grain size can be from micron to millimeter. For the same kind of target, the sputtering rate of the target with fine grains is faster than that of the target with coarse grains; and the thickness distribution of the film deposited by sputtering of the target with small difference in grain size (uniform distribution) is more uniform.
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